2UUL PadBall Solder Balls: PB01 & PB02.
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Rs.1,200
Available Variants: PB01 (White Cap) – For iPhone Solder Pad Rework PB02 (Black Cap) – For Android Solder Pad Rework Professional-Grade Rework Balls for iPhone & Android Solder Pad Repair 2UUL PadBall Series (PB01 & PB02) is engineered for precision solder pad rework during IC, BGA, or pad-level repairs. Whether you're restoring iPhone or Android motherboards, these high-quality Sn63/Pb37 solder balls offer uniform size, strong adhesion, and reliable conductivity—perfect for clean, professional results every time.
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| unit | Piece |
| highlights | Tin/Lead Composition: Sn63/Pb37 – ideal for electronics with excellent flow and low oxidation.,Melting Point: 183°C – ensures fast/ clean soldering with minimal heat damage.,Uniform Ball Size: Delivers consistent results during IC planting and pad repair.,100000 Balls/Bottle: Long-lasting supply for service centers and repair technicians.,High Bond Strength: Prevents cold joints and enhances overall pad connectivity. |
| minimum_order | 1 |
| included_items | 2UUL PadBall Solder Balls: PB01 & PB02. |
| package_weight | 0.1 |